About » Program Committee


Executive Technical Program Committee
Mahmoud Almasri
University of Missouri
USA

Gaurav Bahl
University of Illinois
USA

Lourdes Basabe
IKERBASQUE
SPAIN

Tim Brosnihan
Silex Microsystems
USA

Victor J Cadarso
Monash Univeristy
AUSTRALIA

Humberto Campanella
Silicon Austria Labs GmbH
AUSTRIA

Jungwook Choi
Chung-Ang University
KOREA (ROK)

Gerard Cummins
University of Birmingham
UK

Liang Dong
Iowa State University
USA

David Elata
Technion - IIT
ISRAEL

Sophie Giroud
CEA-LETI
FRANCE

Juliet Gopinath
University of Colorado Boulder
USA

Andreas Guentner
ETH Zurich
SWITZERLAND

Kristinn Gylfason
KTH Royal Institute of Technology
SWEDEN

Maesoon Im
KIST
KOREA (ROK)

Mehdi Javanmard
Rutgers University New Brunswick
USA

Bowen Ji
Northwestern Polytechnical University
CHINA

Hanseup Kim
University of Utah
USA

Momoko Kumemura
Kyushu Institute of Technology
JAPAN

Giacomo Langfelder
Politecnico di Milano
ITALY

Chengkuo Lee
National University of Sinagpore
SINGAPORE

Chung Hoon Lee
Marquette University
USA

Hyunjoo Jenny Lee
KAIST
KOREA (ROK)

Joshua Lee
University of Technology Sydney
AUSTRALIA

Sheng-Shian Li
National Tsing Hua University
TAIWAN

Andreu Llobera
Silicon Austria Labs
AUSTRIA

Yipeng Lu
Peking University
CHINA

Massimo Mastrangeli
Delft University of Technology
NETHERLANDS

Hiroaki Onoe
Keio University
JAPAN

Andrea Picco
STMicroelectronics
ITALY

Richard Przybyla
TDK InvenSense
USA

Niels Quack
University of Stuttgart / IMS CHIPS
GERMANY

Mina Rais-Zadeh
NASA JPL
USA

Matteo Rinaldi
Northeastern University
USA

Tuhin Santra
Indian Institute of Technology
INDIA

Ashwin Seshia
University of Cambridge
UK

Ryan Sochol
University of Maryland
USA

Sameer Sonkusale
Tufts University
USA

Boris Stoeber
The University of British Columbia
CANADA

Yuji Suzuki
The University of Tokyo
JAPAN

Erdinc Tatar
Bilkent University
TURKEY

Alexander Trusov
Northrop Grumman
USA

Elizaveta Vereshchagina
SINTEF Digital
NORWAY

Guillermo Villanueva
EPFL
SWITZERLAND

Chen Wang
KU Leuven
BELGIUM

Yansong Yang
Hong Kong Univ. of Science and Tech.
HONG KONG

Hemin Zhang
Northwestern Polytechnical University
CHINA

Sam Zhang
Analog Devices, Inc.
USA


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